Unreleased Intel CPU with LGA1851 Socket Caught on Camera

By Anton Shilov
published

Intel's LGA1851 CPU allegedly pictured.

Intel
(Image credit: @wxnod/Twitter)

Respected hardware leaker @wxnod has published a picture of what seems to be an Intel processor in LGA1851 packaging. The new chip could be Intel's Meteor Lake-S or Arrow Lake-S and its main difference with the current Raptor Lake-S is a slightly altered integrated heat spreader (IHS). Given that the image is published without any explanations, this could be a prototype of an Alder Lake processor that never hit the market.

Intel's sockets formally called LGA1700 and LGA1851 are essentially the same socket with 0.8 mm pitch, but the latter has more active pins. This allows makers of motherboards and cooling systems to maintain their designs. Meanwhile, LGA1851 will increase the height of IHS from 6.73-7.4 mm to 6.83-7.49 mm, according to earlier reports. To prevent installation of LGA1851 processors into 1700-pin sockets, the upcoming CPUs will have a different cutout configuration.

Perhaps the most interesting part about the processor marked as 'Intel Confidential NA QDF4' is their slightly larger heatspreader. It is unclear whether the taller heatspreader was made slightly larger to prevent bending that Intel's LGA1700 processors are known for, but this is certainly a possibility. 

If the CPU is Intel's Meteor Lake-S, then it will never reach the market as the platform has been cancelled. Meanwhile, the processor still gives an idea how Intel's LGA1851 CPUs will look like when they come to market in 2024 in the form of Intel's Arrow Lake products.

Anton Shilov
Anton Shilov
Freelance News Writer

Anton Shilov is a Freelance News Writer at Tom’s Hardware US. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.

13 Comments Comment from the forums
  • bit_user
    the processor still gives an idea how Intel's LGA1851 CPUs will look like when they come to market in 2024 in the form of Intel's Arrow Lake products.
    Something you guys should ask Intel, at their upcoming press events: How long will that platform last? Is it going to be one-and-done, since LGA1700 got extended for another year?

    I can imagine Intel might want to start dabbling with in-package memory, and that's probably going to require changes in package dimensions. If they were going to do that in 2025, I doubt they'll delay for a year, just to placate partners and motherboard makers.
    https://www.anandtech.com/show/20008/sk-hynix-launches-24gb-lpddr5x8500-stacks-for-smartphones-pcs-and-hpc
    Reply
  • InvalidError
    bit_user said:
    Something you guys should ask Intel, at their upcoming press events: How long will that platform last? Is it going to be one-and-done, since LGA1700 got extended for another year?
    Likely to be two generations as usual, which would likely be 14th and 15th.

    bit_user said:
    I can imagine Intel might want to start dabbling with in-package memory, and that's probably going to require changes in package dimensions.
    Unless they stack it on the SoC tile, then it requires zero added substrate space. If Intel is going to do full 3D packaging, there is no reason not to start with stacking memory on SoC first, one of few 3D-stacking things that can be done without worrying much about power density.
    Reply
  • bit_user
    InvalidError said:
    Unless they stack it on the SoC tile, then it requires zero added substrate space.
    Will that have enough area for two stacks? According to the article I linked, each stack has a 64-bit interface.
    Reply
  • InvalidError
    bit_user said:
    Will that have enough area for two stacks? According to the article I linked, each stack has a 64-bit interface.
    16Gbits DRAM dies are only about 90sqmm, stack then 8-high and you have 16GB that you can slap onto just about anything. Interface-wise, if you are going to stack DRAM onto an SoC die, the interface can be whatever gets agreed to.
    Reply
  • PEnns
    Yay, a new motherboard requirement from Intel!!

    I doubt TH reviewers will see this as a major negative as much as they did with AMD, in EVERY review!!!!!

    Don't hold your breath.
    Reply
  • The Historical Fidelity
    PEnns said:
    Yay, a new motherboard requirement from Intel!!

    I doubt TH reviewers will see this as a major negative as much as they did with AMD, in EVERY review!!!!!

    Don't hold your breath.
    Yeah,

    AMD:
    “New motherboard socket after being able to use previous am4 mobo’s for 4 CPU generations = negative & expensive”
    “only comes in DDR5 flavor = negative & expensive” even though they know AMD designed am5 for another 4 cpu generations and DDR4 support would be useless after the first gen and make the socket more expensive.
    “can re-use am4 coolers on am5 CPU’s = nothing to see here folks!”

    Intel:
    New motherboard every 2 generations is A-OK!!!
    LGA1700 motherboards come with both DDR4 & 5 support is better than AM5’s DDR5 only support.
    And I speculate reviewers will now say “LGA1851 DDR5 only support is a POSITIVE because DDR4 is old tech and DDR5 is higher performance!”

    Typical Intel fueled bias incoming.
    Reply
  • InvalidError
    The Historical Fidelity said:
    Yeah,

    AMD:
    “New motherboard socket after being able to use previous am4 mobo’s for 4 CPU generations = negative & expensive”
    The worst part with AMD's new platforms is that AMD needs about a year to work quite substantial bugs out. It is also fair to take issue with how AM5 being DDR5-only means ~$100 more expensive entry-level cost vs Intel's.

    The Historical Fidelity said:
    Intel:
    New motherboard every 2 generations is A-OK!!!
    For most sane people, it is perfectly fine. In the grand scheme of things, most home and office PCs will not see an upgrade within their lifetime with their original owner, maybe only at recyclers trying to maximize the value they can extract from the parts they get. For the general population, I bet less than 5% of PCs ever get "first life" upgrades. About 75% of PC sales are laptops where most stuff is soldered on the motherboard and upgrades are practically impossible to begin with.
    Reply
  • bit_user
    InvalidError said:
    The worst part with AMD's new platforms is that AMD needs about a year to work quite substantial bugs out. It is also fair to take issue with how AM5 being DDR5-only means ~$100 more expensive entry-level cost vs Intel's.
    Yes, it's fair to point that out. However, Ryzen 5000/AM4 also has been a viable option for entry-level, and saw good discounts after the launch of 7000/AM5, and that also should be given consideration. So, in a real sense, AMD did retain a DDR4 entry-level platform.

    Earlier this year, I just bought an AM4 board + CPU + DDR4 RAM.
    Reply
  • The Historical Fidelity
    InvalidError said:
    The worst part with AMD's new platforms is that AMD needs about a year to work quite substantial bugs out. It is also fair to take issue with how AM5 being DDR5-only means ~$100 more expensive entry-level cost vs Intel's.


    For most sane people, it is perfectly fine. In the grand scheme of things, most home and office PCs will not see an upgrade within their lifetime with their original owner, maybe only at recyclers trying to maximize the value they can extract from the parts they get. For the general population, I bet less than 5% of PCs ever get "first life" upgrades. About 75% of PC sales are laptops where most stuff is soldered on the motherboard and upgrades are practically impossible to begin with.
    Okay so you agree that LGA1851 being DDR5 only = negative & expensive
    Reply
  • Lucky_SLS
    "Meanwhile, LGA1851 will increase the height of IHS from 6.73-7.4 mm to 6.83-7.49 mm"

    Shouldnt this be from 6.73 - 6.83 to 7.4 -7.49 mm?

    otherwise, those tolerance dont look so good...
    Reply